Shanghai YoungSoul Electronics Technology Co., Ltd. is located in Shanghai China. We have a total 150 people R&D, production, sales and after-service team to provide high-speed test handler equipment, ultra high speed Ag paste die bonder equipment (including eutectic die bonder) and clip bonder equipment(integrated design by high speed automatic die bonder, clip bonding and reflow) for semiconductor industry in China and overseas.
And the equipment is widely used in back-end process of optoelectronics, sensors, power devices, small signals and other discrete device and analog IC and digital IC of integrated circuit IC.