Company established in 2010. The company has two production bases with an area of 8,000 square meters and a total of 300 employees.
Taijin has had growing from making an IC package lead frame Transfer molds to become a professional research & development company for semiconductor packaging equipment.
The main business includes: Lead frame transfer mold, MGP mold, IC plastic mold, Fully automatic transfer equipment, Auto Molding System, Trim & Form systems, de -gate machine and other packaging system for package type of TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGA, DFN, etc.
The company has gained the ISO 9001 and was granted as High-Tech Enterprise.