Vi Laser , founded in 2014 and headquartered in Shenzhen, China. By leveraging proprietary laser soldering technology, our equipment achieves welding precision up to ±0.01mm, fully meeting the demands of miniaturized and high-density electronic components. Key features include:
Laser Solder Ball Welding: Spatter-free and residue-free, ensuring reliable connections for ultra-fine pitch BGA, CSP, and other chip packages.
Solder Wire Welding: Flexible and efficient, ideal for automated welding of FPCs, PCBs, sensors,and precision components. Our equipment delivers unparalleled welding solutions for photonics, consumer electronics, automotive components, smart appliances, semiconductors, and power capacitors.