Development and production of bipolar and field transistors, diode transistor modules, optoelectronic devices, hybrid microcircuits and microwave receiving and transmitting modules, packages of semiconductor devices and microcircuits, including microwaves. Production of multilaer printed circuit boards by LTCC technology and thin film boards. Development of basic packaging and assembling technologies for electronic modules and radioelectronic equipment. Diffusion and high-temperature bonding, mechanical treatment (CNC, punching), electroplating. Investigation and introduction of new constructional materials with improved thermal and electrical characteristics. Electronic component base certification tests. Production of components for medical equipment.