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ExpoElectronica 2023
Русский
Countries:
-
Armenia
Belarus
China
Hong Kong Special Administrative Region of China
India
Russia
Serbia
Singapore
Türkiye
United Arab Emirates
Main categories:
-
1. Electronic components, modules and subsystems
1.1. Semiconductor components and modules
1.1.1. Integrated circuits
1.1.10. Other
1.1.2. ASSP/ASIC
1.1.3. Programmable Logic Integrated Circuits (FPGAs)
1.1.4. Radio-frequency (RF) and microwave components
1.1.5. Microsystems Devices (MEMS, NEMS)
1.1.6. Discrete Semiconductor Components
1.1.7. Optoelectronic Semiconductor Devices, photonics
1.1.8. Power Electronic Components, IGBT modules, MOSFET modules
1.1.9. Components of LED
1.2. Passive components
1.2.1. Capacitors
1.2.2. Resistors
1.2.3. Piezoelectric components
1.2.4. Inductors (chokes) and ferromagnetic components, transformers
1.2.5. Switches
1.2.6. Antennas
1.2.7. Other
1.3. Electromechanics
1.3.1. Cables and cable assemblies
1.3.2. Cases and components
1.3.3. Relays, switches, keyboards
1.3.4. Interconnection components
1.3.5. Electric fans, radiators and other cooling systems
1.3.6. Electromagnetic compatibility components
1.3.7. Other
1.4. PCBs
1.4.1. Multilayer PCBs
1.4.2. Single / Double Sided PCBs
1.4.3. Flexible and ceramic PCBs
1.4.4. Other
1.5. Sensors and control devices
1.5.1. Sensors, including semiconductor and MEMS
1.5.2. Input / output devices, controllers, alarms
1.5.3. Electronic protection devices
1.5.4. Other
1.6. Embedded systems
1.6.1. Components for Embedded systems
1.6.2. Assemblies / Modules
1.6.3. Other
1.7. Displays
1.7.1. LCD/TFT/OLED displays
1.7.2. Electronic Paper Displays
1.7.3. Display Periphery and Elements
1.7.4. Other
1.8. Power Electronics
1.8.1. Power supplies, converters, inverters and rectifiers
1.8.2. Batteries and accumulators
1.8.3. Power management systems, energy storage systems
1.8.4. Power builds
1.8.5. Drivers
1.8.6. Other
1.9. Marking
1.9.1. RFID and NFC components
1.9.2. Marking tags and color coding
1.9.3. Other
2. Technologies, equipment and materials for electronic manufacturing
2.1. Microelectronics processing equipment and materials
2.1.1. Lithography cluster equipment
2.1.2. Equipment for chemical and plasmachemical processing
2.1.3. Deposition and implantation equipment
2.1.4. Thinning, scribing, mounting and packaging equipment
2.1.5. Clean rooms, engineering systems and special buildings. Design and construction
2.1.6. Equipment for testing and measuring microelectronic products
2.1.7. Wafers, substrates and other materials
2.1.8. Other
2.2. Electronics and Electronic Components Manufacturing Equipment
2.2.1. Equipment, tools and accessories for mechanical machining
2.2.2. Equipment for assembly, sealing and packaging of components
2.2.3. Equipment for chemical processing
2.2.4. Additive and laser technology in component manufacturing
2.2.5. Manual soldering, product finishing, repair and prototyping
2.2.6. Materials for the production of electronic devices and components
2.2.7. Special process equipment
2.2.8. Specialized rooms for testing electronic devices (shielded, anechoic, etc.)
2.2.9. Other
2.3. Assembly and surface-mounting equipment
2.3.1. PCB separation and preparation equipment
2.3.2. Automatic component mounting machines
2.3.3. Soldering equipment, convection ovens, conveyor systems
2.3.4. Materials and equipment for mounting of components/boards/assemblies
2.3.5. Other
2.4. Printed circuit boards (PCB) production
2.4.1. PCB production equipment
2.4.2. PCB marking equipment
2.4.3. PCB design
2.4.4. Materials for the production of PCB
2.4.5. Instruments for the production of PCB
2.4.6. Other
2.5. Cable and wire processing equipment
2.5.1. Cable and wire processing and crimping equipment/machines
2.5.2. Equipment and materials for cable marking
2.5.3. Electrical Insulating Materials and Technologies
2.5.4. Other
2.6. Оборудование для тестирования, измерений и испытаний ЭКБ и электронных систем
2.6.1. Certification, standardization and metrology in the electronics industry
2.6.2. Equipment for testing and training electronic components
2.6.3. Test and measuring equipment and tools
2.6.4. Non-destructive testing equipment
2.6.5. Other
2.7. Industrial furniture and clothing for electronics manufacturing
2.7.1. Industrial / Antistatic Furniture
2.7.2. Special technological clothing / footwear
2.7.3. Decontamination, cleaning equipment, disposal
2.7.4. Other
2.8. Electronic devices design and manufacturing services
2.8.1. Design and Engineering Centers
2.8.2. CAD/CAE/EDA tools and IP-blocks
2.8.3. Foundries
2.8.4. Electronic manufacturing services (EMS)
2.8.5. Other
3. Turnkey solutions and embedded systems
3.1. Embedded systems
3.1.1. Components and modules
3.1.2. Hardware development tools
3.1.3. Embedded Peripherals
3.1.4. Software tools and applications
3.1.5. Ready-made solutions for various applications
3.1.6. Other
3.2. Equipment for critical infrastructure facilities, data storage systems
3.2.1. Data processing and storage systems
3.2.2. Hardware and software systems
3.2.3. Cybersecurity and Trusted Platforms
3.2.4. Comprehensive Security and Surveillance Solutions
3.2.5. Infrastructure technologies for a smart city
3.2.6. Other
3.3. InformationTechnologies
3.3.1. Computer and network technologies for office and production
3.3.2. Personal and wearable electronics, wireless networks and the Internet of things
3.3.3. Integrated high-tech solutions, cloud computing, data processing
3.3.4. Components and solutions for artificial intelligence applications
3.3.5. Telecommunication equipment
3.3.6. Software development and support
3.3.7. Other
3.4. Smart manufacturing and automation
3.4.1. Automated and remote production control systems
3.4.2. Solutions and components for automation and digitalization of production
3.4.3. Automation and virtualization of workplaces
3.4.4. Automated business process management systems
3.4.5. Technologies and practices of digital twins in industry and business
3.4.6. Complexes of virtual and augmented reality
3.4.7. Software development and support
3.4.8. Other
3.5. Electronic transport systems
3.5.1. Autoelectronics of traditional and electric vehicles
3.5.2. Unmanned vehicles and telematics
3.5.3. Avionics and systems based on GLONASS
3.5.4. Software development and support
3.5.5. Other
3.6. Medical electronics and telemedicine
3.6.1. Medical devices
3.6.2. Digital medicine and telematics
3.6.3. Biomechanical electronic devices
3.6.4. Personal assistants
3.6.5. Software development and support
3.6.6. Other
3.7. Robototechnics
3.7.1. Components, assemblies and software solutions
3.7.2. Specialized solutions in robotics
3.7.3. Artificial intelligence and control systems
3.7.4. Other
3.8. Emerging technologies
3.8.1. AI components
3.8.10. Other
3.8.2. 5G, 6G components and solutions
3.8.3. IoT components and solutions
3.8.4. Blockchain technologies
3.8.5. Computing engineering
3.8.6. Quantum technologies
3.8.7. RISC-V devices
3.8.8. Electronic payment and identification (ID) systems
3.8.9. Cyber-Physical Systems
3.9. Education
3.9.1. Research Laboratories
3.9.2. Specialized universities and faculties
3.9.3. Additional and corporate training programs
3.9.4. Vocational education, WorkSkills
3.9.5. Other
Name:
Product catalogue
Product name
Main categories
Exhibitor Name
Stand
. Programmable Logic Integrated Circuits (FPGAs)
1.1.3. Programmable Logic Integrated Circuits (FPGAs)
PengXingWei
A6175
“Smart film” with variable light transmission
1.1.10. Other
TENFLECS
A9157
10 layers PCB for communication system of automobile
2.2 Multilayer PCBs
Chengyi Electronics (Jiaxing) Co.,Ltd.
A7127
12L Halogen free FR4
1.4.1. Multilayer PCBs
Chinapcbone technology limited
A8105
12L HDI Gold Fingers
1.4.1. Multilayer PCBs
Shenzhen Giant Change Circuits Co., Ltd
A7105
130kV Microfocus X-ray AX9100
2.6.4. Non-destructive testing equipment
Unicomp Technology
A3187
130kV Microfocus X-ray tube
2.6.3. Test and measuring equipment and tools
Unicomp Technology
A3187
1382НХ065 IC of magnetic field converter
1.5. Microsystems Devices (MEMS, NEMS)
Zelenograd nanotechnology center, JSC
A6095
1469TK SERIES MICROCIRCUIT FOR PROTECTION OF EQUIPMENT AGAINST THYRISTOR EFFECT
1.2. ASSP/ASIC
Technological Centre, Scientific-Manufacturing Complex
A9153
14-Bit A/D Converters
1.2. ASSP/ASIC
SOYUZ, DESIGN CENTER, JSC
A7085
14-Bit A/D Converters
1.2. ASSP/ASIC
SOYUZ, DESIGN CENTER, JSC
A7085
18650
1.8.2. Batteries and accumulators
Bonrex Technology Co.,Ltd
A8151
1-Wire Digital termometer
5. Sensors and control devices
SOYUZ, DESIGN CENTER, JSC
A7085
20L Rigid&Flex
1.4.3. Flexible and ceramic PCBs
Shenzhen Giant Change Circuits Co., Ltd
A7105
22L Gold plating
1.4.1. Multilayer PCBs
Chinapcbone technology limited
A8105
2-Channel 12-Bit A/D Converters
SOYUZ, DESIGN CENTER, JSC
A7085
2-Channel 12-Bit D/A Converters
4.3 Analog and analog-to-digital microcircuits
SOYUZ, DESIGN CENTER, JSC
A7085
3.5inch HMI Display
1.7.1. LCD/TFT/OLED displays
Shenzhen Elsun Technology Co.,Ltd
A9137
3.5inch QVGA Display
1.7.1. LCD/TFT/OLED displays
Shenzhen Elsun Technology Co.,Ltd
A9137
32L ATE
1.4. PCBs
Shenzhen Giant Change Circuits Co., Ltd
A7105
3D AOI YRI-V, YAMAHA
15.7. Test and measurement equipment
AssemRus, LLC
A2053
3D AOI YSI-V, YAMAHA
15.7. Test and measurement equipment
AssemRus, LLC
A2053
3D inline AXI X-ray LX9200
2.6.4. Non-destructive testing equipment
Unicomp Technology
A3187
3-terminal LED drivers: AN9921 (20МА), AN9922 (50МА), AN9923 (30МА)
12. Other
Angstrem JSC
A5103
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