12 LAYER COMMUNICATION HIGH SPEED PCB

Basic characteristics:

  • Board thickness: 3.0mm
  • Material: Panasonic M6
  • Trace Width/Space: 3.5/3.5mil
  • Minimum hole: 0.15mm
  • Surface finish: ENIG
  • Process features: 12 sets of back drilling and 32 sets of impedance, Depth control ladder